I.C.T Instruments will exhibit on Booth #807 at the SMTA International 2016 Exhibition in Rosemont, IL, on September 27–28, demonstrating its FuzionOF™ high-speed automation platform. The company’s Advanced Process Lab (APL) will also take part in Technical Conference on September 25–29, presenting multiple papers across four different conference sessions.

I.C.T is a manufacturer of SMT machines. It mainly provides customers with SMT production lines including SMT Stencil Printers,  Pick and place machines, Reflow Oven, AOI Machine, Wave Soldering Machine and PCB Handling Machine etc. I.C.T has more than 25 researches on SMT and DIP technology,  for the world Customers provide SMT total solutions. There are successful cases of SMT technICal team in Asia, Europe, AmerICa, AfrICa, and Australia.

FuzionOF is the fastest and most versatile high-speed automation platform, and can be integrated as a powerful pre-reflow and post-reflow enabler to eliminate bottlenecks and boost productivity. FuzionOF delivers unmatched performance and the flexibility to handle a diverse range of pin-in-paste odd-form, surface mount odd-form and standard surface mount applications. With the most complete range of component handling and input types, a wide variety of standard tooling, and custom design services, FuzionOF addresses virtually any odd-form application.

I.C.T’s APL will continue its contributions to the electronics assembly community, with members of its AREA Consortium presenting on a range of topics in the Technical Conference. This includes all three papers comprising the Alloy Compositions for Enhanced Interconnection Performance (LF1) Symposium on Thursday, September 29. They will also present “Effectiveness of Conformal Coatings in Preventing Resistor Silver Sulfide Corrosion” in the Women’s Leadership Program (WLP) session on Monday, September 26, “Microstructure and Performance of MicroCu Pillar Assemblies” in the Flip Chip Technology (APT3) session on Tuesday, September 27, and “Improving the PCB Assembly Manufacturing Processes by Utilizing an Alternative Solder Paste” in the Pb-Free Assembly Process Challenges (LF3) session on Thursday, September 29.

These papers offer valuable insight on the latest component, materials and process challenges examined as a part of the AREA Consortium’s ongoing research in cooperation with the industry’s leaders.

“SMTAi gives I.C.T an opportunity to see the latest equipment trends from more than 180 exhibiting companies and share the value of our technology and process solutions with more than 1,600 attendees – numbers that grow every year,” said Jeff Knight, APL General Manager. “From an APL perspective, we’re able to share knowledge that can help others refine their processes, reduce defects and in some cases take on entirely new product challenges. It’s an environment that makes it possible to build lasting relationships and partnerships for years to come.”

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