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SPECIFICATIONS
Min. Qty. |
4 boards |
Max. Qty. |
20 boards |
Board Thickness |
0.031" and 0.062" |
Material |
FR4 (Tg135 and Tg170) |
Max Square Inches |
60 sq"/board |
Max Dimension |
7.85" |
Min Dimension |
0.4" |
Copper Weight |
1 oz |
Min Hole Size |
10mil (0.25mm) |
Number of holes |
< 10 holes/cm2 |
Plated and Non-Plated Holes |
OK |
Min Trace/Space |
5 mil/5mil (0.13mm) |
Finish Plating: |
Lead, Lead Free and ENIG |
Solder Mask |
Both Sides - Green, Black, Blue, Red & White |
Silk Screen |
Both Sides - White, Black & Yellow |
Inspection |
Class II |
Tooling |
FREE |
Electrical Test |
FREE |
Circuit board panel (v-score / tab route) - Multiple designs allowed. |
RESTRICTIONS
-
Complex Board Shapes
-
No Internal Routing, Slots, Cutouts or Overlapping Drills
-
No Blind / Buried Vias
-
No Counter Bores or Counter Sinks
-
No ITAR Compliance (China PCB)
OFFSHORE PROTOTYPE PCBS STACK-UP
|
2 LAYER |
4 LAYER |
6 LAYER |
8 LAYER |
Layer 1 |
1 oz Copper |
1 oz Copper |
1 oz Copper |
1 oz Copper |
DIELECTRIC |
0.059"=1.5mm |
4.73 mil=0.12mm |
4.73 mil=0.12mm |
7.09 mil=0.18mm |
Layer 2 |
1.0 oz Copper |
1.0 oz Copper |
1.0 oz Copper |
1.0 oz Copper |
DIELECTRIC |
|
44.9mil=1.14mm |
16.89 mil=0.43mm |
7.2 mil=0.183mm |
Layer 3 |
|
1.0 oz Copper |
1.0 oz Copper |
1.0 oz Copper |
DIELECTRIC |
|
4.73 mil=0.12mm |
8.27mil=0.21mm |
7.09 mil=0.18mm |
Layer 4 |
|
1.0 oz Copper |
1.0 oz Copper |
1.0 oz Copper |
DIELECTRIC |
|
|
16.89 mil=0.43mm |
7.09 mil=0.18mm |
Layer 5 |
|
|
1.0 oz Copper |
1.0 oz Copper |
DIELECTRIC |
|
|
4.73 mil=0.12mm |
7.09 mil=0.18mm |
Layer 6 |
|
|
1.0 oz Copper |
1.0 oz Copper |
DIELECTRIC |
|
|
|
7.2 mil=0.183mm |
Layer 7 |
|
|
|
1.0 oz Copper |
DIELECTRIC |
|
|
|
7.09 mil=0.18mm |
Layer 8 |
|
|
|
1.0 oz Copper |
Finish Thickness |
0.062" |
0.062" |
0.062" |
0.062" |
OFFSHORE PROTOTYPE PCBS STACK-UP
|
2 LAYER |
4 LAYER |
6 LAYER |
Layer 1 |
1 oz Copper |
1 oz Copper |
1 oz Copper |
DIELECTRIC |
27.56 mil = 0.7mm |
4.53 mil = 0.115mm |
4 mil = 0.1mm |
Layer 2 |
1.0 oz Copper |
1.0 oz Copper |
1.0 oz Copper |
DIELECTRIC |
|
15.75mil = 0.4mm |
6.7 mil = 0.17mm |
Layer 3 |
|
1.0 oz Copper |
1.0 oz Copper |
DIELECTRIC |
|
4.53 mil = 0.115mm |
4 mil = 0.1mm |
Layer 4 |
|
1.0 oz Copper |
1.0 oz Copper |
DIELECTRIC |
|
|
6.7 mil = 0.17mm |
Layer 5 |
|
|
1.0 oz Copper |
DIELECTRIC |
|
|
4 mil = 0.1mm |
Layer 6 |
|
|
1.0 oz Copper |
Finish Thickness |
0.031" |
0.031" |
0.031" |
Keywords:
SMT Line Xray, SMT Screening Line, Thermal Profiler For Reflow Oven, DIP Soldering Machine Semi AutomatIC, Chip Shooter, Chip Shooter Machine, SMT Chip Shooter, Asm PICk And Place, PICk And Place Assembly, Yamaha SMT Machine PrICe, Chip Mounter Machine, PCB Stencil Cleaning Washing Machine, Solder Resist PCB Cleaning Machine, Cleaning Machine Driver Board PCB, Cleaning Machine Power Driver Board PCB
I.C.T is a manufacturer of SMT machines. It mainly provides customers with SMT production lines including SMT Stencil Printers, Pick and place machines, Reflow Oven, AOI Machine, Wave Soldering Machine and PCB Handling Machine etc. I.C.T has more than 25 researches on SMT and DIP technology, for the world Customers provide SMT total solutions. There are successful cases of SMT technical team in Asia, Europe, America, Africa, and Australia.
I.C.T provide SMT solutions at various stages according to the different needs of customers. I.C.T is not only a provider of SMT equipment and technology, but also is the customer's escort in the field of SMT and DIP.
Welcome more people to discuss with us about SMT technologies and solutions, please contact us for more information:
Tel: +86 13670124230 (WhatsApp/Skype/WeChat)
Email: etasmt@foxmail.com
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