Brand::

YAMAHA

MODEL:

Yg100

Weight::

1630KG

Lead Time::

1-2days

Packing::

Vacuum&woodenbox

POWER:

Three Phase AC 200/208/220/240/380/400/416 V +/-10%

PAYMENT TERM:

T/T, Paypal, Westernunion Are All Allowed

Warranty:

1YEAR

Delivery Term:

Exw Fob Cif...

Year:

2010

Size:

1,650×1,562×1,850mm

High Light:

smt pick and place equipment

, 

pcb pick and place machine

Model Name High Speed Modular Mounter FX-3RL

Substrate size Component height L For substrate (410 × 360mm) ○

L-wide substrate with 510 × 360mm) * ○

XL type substrate (610mm × 560mm) ○

Component height 6mm specification ○

Component size Laser recognition 0402 (Inch 01005) ~ □ 33.5mm

Component placement speed (chip component) Chip component Optimal condition 0.040 sec/chip (90,000 CPH)

(IPC9850) 66,000CPH

Component placement accuracy Laser recognition ±0.05mm (Cpk≧1)

Component mounting type Up to 120 types (converted to 8mm tape)

Power supply Three-phase AC200~415V

Rated power 8.5KVA/9.5kva

Use air pressure 0.5±0.05Mpa

Air consumption (standard state) up to 150L/min

Device size (W × D × H**) L substrate 2, 650 × 1, 650 × 1, 530mm

L-wide substrate * 2,880 × 1,650 × 1,530mm

XL type substrate 2,880×1, 1850×1,530mm

Weight L, L-wide substrate about 3,500kg

XL type substrate about 3,750kg

JUKI FX-1 parameters

Model: FX-1R

Substrate size: 410*360MM

Component height: 6mm

Component size: laser identification 0603 (Inch 0201) chip ~ 20mm square component or 26.5 * 11mm

Component placement speed: CHIP parts: 33000 CPH (best condition)

CHIP parts: 25000CPH (IPC9850)

Component placement accuracy: ±0.05mm

Component mounting type: up to 80 types

Weight: about 2000KG

Power supply: three-phase AC200~415V

Rated power: 3KVA

Air pressure: 0.5±0.05Mpa

Appearance size: 1880×1731×1490mm

Weight: 2000kg