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FRAMED ULTRASLIC™ STENCILS

From:    Author:FRAMED ULTRASLIC™ STENCILS    Publish time:2021-09-16 10:42    Clicks:0

An alternative to Electroform Stencil, UltraSlic™.

UltraSlic™ FG outperforms all other existing stencil technologies on the market today, and it can be shipped in 48 hours turnaround times.

  • Fine Grain stainless steel with superior fatigue strength, super smooth surface and elevated wear factor
  • Superior paste release below surface area ratios of 0.5
  • Higher performance and lower cost compared to electroform, the option of step stencils

OVERVIEW

Ultracomp

The UltraSlic™ high performance stencil technology has become the preferred choice when printing assemblies with challenging miniature components. The addition of a permanent, hydrophobic nano-coating to the UltraSlic™ stencil foil minimizes the ability of solder paste to stick to the stencil apertures and the bottom side of the foil. With the new nano-coating, up to a 10X increase in the number of prints before cleaning the stencil is possible, as well as successful printing at surface area ratios below 0.45.

The UltraSlic™ Stencil is the first laser-cut, solder paste stencil that has paste release performance comparable to electroform technology, yet can be cut and shipped the same day the order is placed. UltraSlic™ Stencils incorporate the latest advancements in stencil laser technology along with a new, cutting-edge Fine Grain stencil material from Datum Alloys.UltraSlic™ Stencils have lower standard deviations, higher repeatability and cleaner release of solder paste compared to other stencil technologies.

A more consistent solder paste deposition, as well as a reduction in stencil cleaning frequency and rework results in higher yields and tremendous throughput improvements.


FINER PRINTING

For solder paste you will see improved print quality and release and especially with paste types 6, 7 and 8 where PSD can be as low as 1 or 2 microns

SUPER SMOOTH

Super smooth surface technology, coupled with our unique wetcoat treatment results in a stencil substrate that will out-print any material on the market.

ULTRASLIC™ STENCILS

are laser cut solder paste stencil foils permanently mounted in a stencil frame using a mesh border to tightly stretch the stencil foil taut in the frame.


SPECS

Technology 100% laser cut
Material Used Fine Grain Stainless Steel
Suitable Application Surface Area Ratios down to 0.45
Positional Accuracy ± 0.008%
Aperture Dimensional Tolerances ± 8µ (0.0003")
Standard Material Thicknesses Available 0.003”, 0.004", 0.005", 0.006" Other thicknesses are available on request.

 

Keywords:

Assembling Line For TV AndLED Panel Lights, PICk And Place Machine Desktop, SMT PICk And Place Machine PrICe, PICk And Place Assembly Machine, PanasonIC PICk And Place Machine, Nozzle PICk And Place Machine, Desk Top PICk And Place Machine, Cut PCB, Cut PCB 0.1, PCB Press Cutting Mchine, PCB Routing Machine, PCB Routing, Router Mimo PCB, CNC Router PCB Making Machine, Router Ups PCB, 0.5MM PCB Router Bit, PCB Router Separator, PCB V Grove Cutting Machine, PCB Separator Machine

 

I.C.T is a manufacturer of SMT machines. It mainly provides customers with SMT production lines including SMT Stencil Printers,  Pick and place machines, Reflow Oven, AOI Machine, Wave Soldering Machine and PCB Handling Machine etc. I.C.T has more than 25 researches on SMT and DIP technology,  for the world Customers provide SMT total solutions. There are successful cases of SMT technical team in Asia, Europe, America, Africa, and Australia.

I.C.T provide SMT solutions at various stages according to the different needs of customers. I.C.T is not only a provider of SMT equipment and technology, but also is the customer's escort in the field of SMT and DIP.

Welcome more people to discuss with us about SMT technologies and solutions, please contact us for more information:

Tel: +86 13670124230 (WhatsApp/Skype/WeChat)

Email: etasmt@foxmail.com

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